Online information source for semiconductor professionals

FEI outsources manufacturing to Ultra Clean Technology

21 January 2009 | By Tom Cheyney | News > Critical Components

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

Samsung and Micron gain most market share in DRAM crisis - 17 February 2009

TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008

Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008

Numonyx to close California Technology Center - 12 August 2008

ultra_clean_panelUltra Clean Technology and FEI have signed a global supplier agreement under which Ultra Clean will provide hosted manufacturing services in FEI's Hillsboro, OR, facility. The companies also anticipate that Ultra Clean's Asia operations will be used to produce some FEI subassemblies. The first quarter of 2009 has been targeted for transfer of current product lines to Ultra Clean operations.

Ultra Clean will provide turnkey manufacturing for products currently manufactured at FEI's Oregon site, as well as for new tools under development. This includes the mechanical and electrical testing of several different modules and final integration, the companies said.

"This agreement is an important part of the restructuring program we announced last spring," said Brian Pierson, FEI's senior VP of worldwide operations, FEI. "Our overall goals include material cost reduction, more effective use of our fixed assets, increased flexibility, and currency balance. Working with high-quality partners such as Ultra Clean will help us reach those goals, while FEI focuses its energy on further technology leadership in growing life sciences, research, and electronics markets."

"We are very excited to be working with FEI as their new outsourcing partner," said Clarence Granger, Ultra Clean's chairman/CEO. "This is an excellent opportunity to utilize our capabilities to extend into new markets."

"At Ultra Clean, we use our core skills to produce high quality, complex, electromechanical assemblies at a cost that rivals offshore manufacturers," added David Savage, Ultra Clean's president/COO. "FEI highly values finding a U.S. outsource partner that could meet their cost targets while providing close, local coordination and business efficiencies."

Related jobs

No related jobs found, sorry!

Related articles

Ultra Clean sees improving demand from semiconductor equipment suppliers - 09 October 2009

Ultra Clean Technology in turnkey probe station manufacturing deal with Cascade Microtech - 24 October 2008

Ultra Clean shifts more manufacturing to Asia - 18 February 2009

Cleanroom Protocol Approaches for the Construction Process - 01 June 2002

New Product: Applied Materials reveals FEOL pre-clean chamber - 21 September 2005

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: