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EV Group has joined the Georgia Institute of Technology 3D Systems Packaging Research Center (GT PRC) as a Manufacturing Infrastructure Member. EVG’s temporary bonding and debonding, chip-to-wafer bonding and lithography technology will be included in the PRC’s Silicon and Glass Interposer Industry (SiGI) Consortium research program in an effort to to understand the applicability of EVG’s manufacturing equipment and solutions for ultra-miniaturized device and systems packaging applications using through-silicon vias (TSVs).

Paul Lindner, EVG’s executive technology director, stated, “EVG co-founded the EMC-3D Semiconductor and Materials Consortium in 2006, with the mission to develop cost-effective and manufacturable TSVs for advanced semiconductors.  Through membership in and collaboration with the PRC, we aim to further develop technologies that will make silicon and glass interposers with TSVs a truly affordable packaging solution.”  

The SiGI Consortium is pursuing, with global partners, development of ultra-thin glass interposers – the intermediate layers typically used for routing electrical interconnections – at 10x lower cost than wafer-based silicon interposers.