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EV Group and CEA/Leti bond further on 3D IC TSV integration

01 April 2009 | By Mark Osborne | News > Wafer Processing

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EV Group (EVG) is to supply French research institute CEA/Leti with its 300mm bonding and debonding technology as part of a joint development program (JDP) to develop 3D IC through-silicon-via (TSV) and 3D integration processes. CEA/Leti and EV Group have already commenced work on the project and claimed to have produced successful results.

"We are extremely pleased to be working with EVG-not only for their proven bonding/debonding and thin-wafer handling technology systems, but also for the tremendous groundwork and expertise on tools for TSV technology and 3D integration they bring to the table, which complements our own know-how in this field," said Nicolas Sillon, head of the laboratory for advanced packaging and 3D integration at Leti.  "TSV and 3D integration is proving to be a viable solution to a critical roadblock in advanced device performance.  Together we can continue to unlock the full potential of this technology to ensure widespread commercialization for high-volume applications."

“We are seeing an increasing number of high-volume manufacturers exploring implementation of this technology in their production lines, and this joint effort with CEA/Leti will be instrumental in continuing this positive momentum," noted Stefan Pargfrieder, EVG's Business Development Manager.

EVG said that the new JDP strengthens the existing joint development activities between Brewer Science, EVG and Leti. 

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