Online information source for semiconductor professionals

EV Group and CEA/Leti bond further on 3D IC TSV integration

01 April 2009 | By Mark Osborne | News > Wafer Processing

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

EV Group (EVG) is to supply French research institute CEA/Leti with its 300mm bonding and debonding technology as part of a joint development program (JDP) to develop 3D IC through-silicon-via (TSV) and 3D integration processes. CEA/Leti and EV Group have already commenced work on the project and claimed to have produced successful results.

"We are extremely pleased to be working with EVG-not only for their proven bonding/debonding and thin-wafer handling technology systems, but also for the tremendous groundwork and expertise on tools for TSV technology and 3D integration they bring to the table, which complements our own know-how in this field," said Nicolas Sillon, head of the laboratory for advanced packaging and 3D integration at Leti.  "TSV and 3D integration is proving to be a viable solution to a critical roadblock in advanced device performance.  Together we can continue to unlock the full potential of this technology to ensure widespread commercialization for high-volume applications."

“We are seeing an increasing number of high-volume manufacturers exploring implementation of this technology in their production lines, and this joint effort with CEA/Leti will be instrumental in continuing this positive momentum," noted Stefan Pargfrieder, EVG's Business Development Manager.

EVG said that the new JDP strengthens the existing joint development activities between Brewer Science, EVG and Leti. 

Related articles

CEA-Leti starts ramping 300mm 3D-integration line - 19 January 2011

Elpida redeems significant bond amid DRAM worries - 11 December 2008

Soitec and CEA-Leti add 3D IC integration process customization for prototype demonstration - 01 December 2009

Leti and R3Logic team on 3D silicon integration and packaging program - 21 January 2010

Industrialisation of e-Beam lithography begins at Leti - 21 July 2009

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: