Online information source for semiconductor professionals

Elpida redeems significant bond amid DRAM worries

11 December 2008 | By Síle Mc Mahon | News > Fab Management

Popular articles

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Samsung and Micron gain most market share in DRAM crisis - 17 February 2009

ElpidaAccording to a report by Reuters, Elpida Memory, Inc. has announced its intention to redeem all or part of a $540 million convertible bond it had issued to Nomura Holdings, a major financial services company. The bond has had a significant effect on the company’s share price, which plunged by 75% following the announcement of this bond redemption on Thursday. The ¥50 billion yen ($540 million) raised via the bond in the last month was to be used as an investment to further shrink the company’s chips.

Elpida had agreed on a condition for the bond, which stipulated that it would pay back the money if Elpida’s share price stayed below ¥509 for 20 consecutive days, which it did. Concern is growing for the DRAM manufacturer, as it now needs to raise funding to remain competitive in the ailing industry.

 

Related jobs

No related jobs found, sorry!

Related articles

Elpida sales fell 19% in FY2008: US$1.9 billion loss - 27 April 2009

Elpida gains first foundry partner - 20 June 2008

Elpida breaks-up monolithic memory mega-fab - 01 July 2009

Elpida consolidates Rexchip Electronics - 16 March 2009

Elpida Memory increases capital spending - 07 August 2008

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: