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e-Shuttle touts full-scale use of EBDW for 65nm logic ICs
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The Fujitsu Microelectronics and Advantest joint venture, e-Shuttle,
has said that its prototyping services for 65nm CMOS logic ICs
manufactured using Electron-Beam Direct Write (EBDW) technology is now
a full scale. The company said that it also successfully applied EBDW
technology to 90nm devices.
"The alliances between mask-less proponent e-Shuttle and mask
makers are symbolic of the direction the industry is taking," said Dr.
Haruo Tsuchikawa, President of e-Shuttle. "These partnerships in Japan
represent the company's first round of alliances; e-Shuttle will also
pursue partnerships with international prototyping companies. We are
now negotiating with prototyping companies in the U.S., Europe and
China."
A second EB lithography system is to be installed in
June, 2008 to be used for 40nm process technology that will be offered
by March, 2009.