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e-Shuttle touts full-scale use of EBDW for 65nm logic ICs

23 May 2008 | By Síle Mc Mahon | News > Lithography

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AdvantestThe Fujitsu Microelectronics and Advantest joint venture, e-Shuttle, has said that its prototyping services for 65nm CMOS logic ICs manufactured using Electron-Beam Direct Write (EBDW) technology is now a full scale. The company said that it also successfully applied EBDW technology to 90nm devices.

"The alliances between mask-less proponent e-Shuttle and mask makers are symbolic of the direction the industry is taking," said Dr. Haruo Tsuchikawa, President of e-Shuttle. "These partnerships in Japan represent the company's first round of alliances; e-Shuttle will also pursue partnerships with international prototyping companies. We are now negotiating with prototyping companies in the U.S., Europe and China."

A second EB lithography system is to be installed in June, 2008 to be used for 40nm process technology that will be offered by March, 2009.

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