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E-beam technology takes collective stage at SPIE Lithography Symposium

23 February 2011 | By Mark Osborne | News > Lithography

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The eBeam Initiative has highlighted that several of its members will present the latest breakthroughs in DFEB mask and direct write technology at the Annual SPIE Advanced Lithography Symposium 2011.

At the SPIE Advanced Lithography Symposium, eBeam Initiative members will present the following papers or posters:

March 1  
 8:15 a.m., Alternative Lithographic Technologies III Conference, Session 1: Keynote - "A comparison of maskless technologies" presented by Aki Fujimura, CEO of D2S, managing sponsor of the eBeam Initiative
 1:50 p.m., Alternative Lithographic Technologies III Conference, Session 3: Maskless Lithography I - "MCC8: Throughput enhancement of EB direct writer" presented by Advantest
 2:50 p.m., Alternative Lithographic Technologies III Conference, Session 3: Maskless Lithography I - "Multishaped Beam: Development status and update on lithography results" presented by Vistec Electron Beam GmbH
    
March 2  
 5:20 p.m., Alternative Lithographic Technologies III Conference, Session 8: Maskless Lithography II - "Model-based mask data preparation (MB-MDP) and impact on resist heating" presented by D2S and NuFlare Technology
 6:00-8:00 p.m., Optical Microlithography XXIV Conference, Poster Session: Mask/Wafer Topography, Layout, and OPC - "Mask data correction methodology in the context of MB-MDP and advanced mask models" presented by D2S and IC Images Technologies
    
March 3  
 11:50 a.m., Alternative Lithographic Technologies III Conference, Session 10: Maskless Lithography III - "Fast characterization of line-end shortening and application of novel LES correction algorithms in e-beam direct write" presented by EQUIcon, Fraunhofer-CNT and Vistec Electron Beam GmbH

In addition to these collaborative papers, a new white paper on DFEB mask technology and overlapping e-beam shots is available on the eBeam Initiative's website.

The eBeam Initiative also announced that four additional companies have joined its ranks. These new members—Artwork Conversion, Grenon Consulting, NCS and Xilinx—strengthen the ecosystem that is critical to supporting the commercialization of DFEB technology.


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