Online information source for semiconductor professionals

Duke University to develop IP on nanotubes to replace copper interconnects

07 November 2005 | By Syanne Olson | News > Wafer Processing

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Arrowhead Research Corp has said that it will work with Duke University and Dr. Jie Liu, a carbon nanotube expert, to bring to market technology that is under development at the University.

"There is a burning need in the semiconductor industry for a new material to replace copper interconnects. We believe the Duke team has a unique solution to this problem," said R. Bruce Stewart, Arrowhead's president. "Our intention is to fund development of a CMOS compatible process at Duke over the next two years, and then partner with device manufacturers to integrate carbon nanotube-based interconnects into their manufacturing processes."

According to Arrowhead, Dr Liu's approach to the integration of carbon nanotubes into silicon structures is completely different to more publicised work to date, that has prompted the IP company to fund the Duke University project to the tune of $680,000 US dollars over the next two years.

Arrowhead will have the exclusive right to license the resulting intellectual property and commercialize the process developed at Duke.

Related articles

Surrey NanoSystems raises US$4.2m for nanotube IC interconnects - 25 August 2009

The Importance of Cu in New Generation Process Technologies - 01 March 2000

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

All-Optical, Non-Contact Metrology for Characterising CMP of Copper Films - 01 March 2000

Evolution of copper plating chemistry requirements for the sub-90-nm node - 01 December 2003

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: