Online information source for semiconductor professionals
DRAM fab utilization rising as prices rise
Popular articles
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
The introduction of Microsoft’s newest operating system is being touted as a key catalyst in the demand for DDR3 DRAM and improved sales of PCs for DRAM fab utilization rates improving, according to DRAMeXchange. According to DRAMeXchange, 4Q09 average monthly wafer-in production will be up to 365K for Taiwanese DRAM vendors in the fourth quarter of 2009, a rise of 68% compared with the production situation in 1Q09.
Wafer-in production for Taiwanese DRAM vendors has rebounded strongly reaching 338K in August, a rise of 86% compared to the low’s seen in 1Q09.
Powerchip Semiconductor was said to have reached 100K wafers-in for September with utilization rates going from as low as 23% in 1Q09 to 77% by the end of the month.
Rexchip is also said to be increasing utilization rates and will be return to full capacity of 80,000wspm and have approximately 15 to 20% of production allocated to DDR3.
In August, Inotera reached 100K, while Nanya was said to have migrated to 50nm technology by the year end.
