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DRAM fab utilization rising as prices rise

17 September 2009 | By Mark Osborne | News > Cleanroom

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The introduction of Microsoft’s newest operating system is being touted as a key catalyst in the demand for DDR3 DRAM and improved sales of PCs for DRAM fab utilization rates improving, according to DRAMeXchange. According to DRAMeXchange, 4Q09 average monthly wafer-in production will be up to 365K for Taiwanese DRAM vendors in the fourth quarter of 2009, a rise of 68% compared with the production situation in 1Q09.

Wafer-in production for Taiwanese DRAM vendors has rebounded strongly reaching 338K in August, a rise of 86% compared to the low’s seen in 1Q09.

Powerchip Semiconductor was said to have reached 100K wafers-in for September with utilization rates going from as low as 23% in 1Q09 to 77% by the end of the month.

Rexchip is also said to be increasing utilization rates and will be return to full capacity of 80,000wspm and have approximately 15 to 20% of production allocated to DDR3.

In August, Inotera reached 100K, while Nanya was said to have migrated to 50nm technology by the year end.

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