Online information source for semiconductor professionals
DRAM capital expenditures to fall 56% in 2009, says DRAMeXchange
Popular articles
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008
According to a new report from DRAMeXchange, capital spending by DRAM manufacturers is expected to fall 56% in 2009, compared to last year. CapEx is set to fall to only US$5.4 billion in 2009, compared to US$ 12.2 billion in 2008 as cash preservation remains the key business objective.
DRAMeXchange also noted that process node migrations are slowed due to cash constraints and the significant costs associated with the adoption of immersion lithography, which is required for 5x nm migrations.
DRAMeXchange calculated that it requires at least US$210 million per 70,000wspm DRAM fab capacity to convert to immersion lithography and a further US$100 million in other tool upgrades to make the transition.