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Dow Electronic Materials joins SEMATECH‚??s development of EUV resists

11 February 2010 | By Mark Osborne | News > Lithography

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Dow Electronic Materials has partnered with SEMATECH’s Resist Materials and Development Center at UAlbany NanoCollege, Albany, NY to advance the development of next-generation extreme ultra-violet lithography (EUVL) materials and resists for use at the 22nm node and beyond.

“This new partnership combines Dow’s experience in photoresist materials, developers, and bottom anti reflective coatings, with SEMATECH’s strengths in the development of fundamental resist processes that are critical for EUV infrastructure,” commented George Barclay, microelectronics R&D director of Semiconductor Technologies at Dow Electronic Materials.

“This collaborative effort reinforces SEMATECH’s commitment to develop cutting-edge resist and materials and accelerate EUV process introduction into pilot line manufacturing,” said John Warlaumont, Vice President of advanced technologies at SEMATECH.  

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