Cymer, Inc. has shipped the world’s first fully integrated laser-produced plasma (LPP) Extreme Ultraviolet (EUV) lithography source tool to ASML in Veldhoven, The Netherlands where it will support integration and testing of next generation EUV lithography scanners. This purchase is the first of many in an agreed multi-unit purchase deal.
Cymer also announced that it has reached a company milestone of 75W of EUV lithography exposure power (full die exposure). With potential boons for the company’s volume manufacturing, Cymer also hinted that it is eyeing a scale-up to 100W exposure power within the current quarter. This would allow for scanner throughput of 60 300mm silicon wafers per hour, a requirement of volume manufacturing with ASML’s EUV technology.
“Our team has worked hard to ship the industry’s first LPP EUV lithography source while achieving new levels of EUV power,” said Bob Akins, Cymer’s CEO. “We are pleased to be partnering with ASML in the advancement of EUV lithography, which will offer high-resolution, high-throughput, manufacturing capability for the production of advanced ICs with critical dimensions below 22nm, enabling the continuation of Moore’s Law for multiple chip generations to come. Within the next few years, chips patterned by EUV lithography will be hundreds of times more powerful than today’s”.