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Centrotherm subsidiary joins Sematech’s FEP to research low-temperature processing techniques

10 April 2012 | By James Williams | News > Wafer Processing

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The latest machines are installed at Cnetrotherm's base last yearSematech has announced that the centrotherm photovoltaics AG subsidiary, centrotherm thermal solutions, will join its Front End Program (FEP) to develop low-temperature processing techniques for use in high-performance logic and advanced memory applications such as metal oxide RRAM devices.

Centrotherm specializes in the research and development of processing tools and high-tech production systems for semiconductor component manufacture. The subsidiary will work on Sematech’s test structures with researchers from the organization's FEP team to produce plasma-based low temperature processes. The teams’ aim is to illustrate the applicability of new devices in high-performance logic transistors and memory devices in sub-14nm advanced technology nodes.

The partnership will work on developing new materials and devices to facilitate reduced thermal budget process flows. Low temperatures are vital to preserving the desirable properties of channel materials and the production of high mobility semiconductors, as channel materials, will be high on the agenda for the alliance.

Centrotherm’s CEO, Peter Augustin, stated, “Sematech provides centrotherm with an excellent test device and characterization platform to help centrotherm identify and demonstrate applications for our tool. This collaboration will enable centrotherm to showcase low temperature processing capabilities to our customers and is part of our ct focus program to expand our Semiconductors & Microelectronics area.”

Sematech's FEP program was initiated to support the continued scaling of logic and memory applications through the supply of new materials, techniques and processes.

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