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CEA-Leti teams with the III-V Lab

08 March 2011 | By Mark Osborne | News > Wafer Processing

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III-V LabIn an effort to bring the performance benefits of III-V components on to silicon CMOS IC platforms, CEA-Leti has joined the III-V Lab, which includes Alcatel-Lucent Bell Labs and Thales as R&D partners. The III-V Lab, which was formed in 2004 and located near Paris, will include an expanded number of researchers as a result, bringing the headcount to more than 130 researchers, technicians, and doctoral candidates.

Gee Rittenhouse, head of Research at Alcatel-Lucent Bell Labs, said “III-V semiconductors have already made a strong impact in optical telecommunications, providing several innovative breakthroughs, and the integration in a silicon microelectronic platform is on our roadmap to further improve performance, cost and energy consumption.”

“As the third partner in the III-V lab, Leti adds deep expertise and essential silicon capabilities to our existing strengths in III-V semiconductors, opening broader opportunities for innovation. Thales will be provided stronger competitive advantages through the III-V Lab, thanks to the early availability for system developments of new components with breakthrough performances,” commented Marko Erman, SVP Research & Technology at Thales. “Combining these complementary technologies is unique and working together with Leti, we will create a world leading center for developing these advanced devices.”

The devices being focused upon include integrated photonic circuits that combine the active and passive functions of III-V and silicon for high-speed telecommunications and data transfer.

High-power and microwave GaN-based microelectronics will also be developed to increase the power density, energy efficiency and compactness of telecommunication, avionics, satellite, defense, energy and transport systems.

The III-Lab will also develop what it claims to be a new generation of cost-effective, compact, ultra-sensitive, highly-selective gas sensors for use in security, industrial process control, and environmental monitoring applications.

In military applications the teams will work on thermal and near-infrared imagery, developing new types of detectors with increased resolution while reducing overall cost.

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