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CEA-Leti starts ramping 300mm 3D-integration line
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CEA-Leti is applying its 3D-integration processes on a new 300mm wafer line that is ramping later this month. The R&D facility in France will be able to process through-silicon vias (TSVs), and advanced capabilities in alignment, bonding, thinning, and interconnects in specific integration schemes for manufacturing optimized die stacks.
“This extension offers important new capabilities to equipment manufacturers and other Leti partners,” said Laurent Malier, CEO of Leti. “Together we will demonstrate 3D and heterogeneous integration technologies on 300mm wafers.”
Leti can now offer heterogeneous integration technologies to customers on both 200mm and 300mm wafers.