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Brewer Scienceâ??s Taiwan lab to use EV Groups wafer bonder for TSV development
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EV Group and Brewer Science are to offer customers in Taiwan and the Asia-Pacific Region access to both companies technology and process offerings for the development and implementation of through-silicon via (TSV) technology for 3D IC packaging. As part of the continued collaboration, EVG's 500 series wafer bonding system was integrated in the applications lab in Taiwan in December 2008. The move is also expected to facilitate training of customer’s engineers in TSV processes.
"With Taiwan, and Asia Pacific generally, home to leading adopters of novel processes such as TSV, the move to jointly manage customer process development locally is a logical progression in advancing our partnership efforts with Brewer Science," commented Stefan Pargfrieder, EVG's business development manager. "By leveraging Brewer Science's facility and equipping them to handle temporary bonding demonstrations, it allows us to have faster cycle times and a more centralized hands-on lab to collaborate closely to adapt the process to our Asia-Pacific customers' requirements."
The companies said that they would be holding a workshop in January 2009.