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BASF to work on 22nm wet chemical cleaning solutions with IMEC

28 July 2009 | By Mark Osborne | News > Wafer Processing

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BASF and IMEC are extending their collaboration for 22nm FEOL wet chemical cleaning solutions in an effort to boost chemical performance while reducing process complexity as well as the number of process steps.

With the adoption of metal transistors a wide range of different metal components exist, which require careful cleaning without causing damage to the structures.

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