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Axcelis to offer sales and support to Ion Beam Services plasma immersion implant tools

06 August 2009 | By Mark Osborne | News > Wafer Processing

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Although Plasma immersion ion implantation (PIII) is regarded as a niche application used primarily for the formation of shallow junctions, trench doping and conformal deposition, amongst others, the market is mainly served by Varian Semiconductor for production applications. Axcelis Technologies has said that it has now teamed with Ion Beam Services (IBS), based in France, to provide sales and support for the PULSION plasma immersion ion implanter. The system is configured for R&D and another system for production applications.

“The PULSION plasma immersion technology offers memory and logic chipmakers compelling cost and performance advantages for ultra high dose applications than what are currently available on the market today," commented Mary Puma, Axcelis Chairman and CEO "This agreement allows Axcelis to provide customers with a broader portfolio of products to meet requirements driven by the ITRS roadmap for decreasing device geometries as well as the emergence of novel transistor structures."

The PULSION system is claimed to achieve high process stability at ultra low energy while offering high dose process versatility at both 200 and 300mm wafer processing. 

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