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austriamicrosystems increases offerings for multi-project wafer service

24 November 2009 | By Mark Osborne | News > Wafer Processing

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For its foundry customers starting in 2010, austriamicrosystems is adding to its Multi-Project Wafer (MPW) offerings and extending the number of shuttle-runs. The company said it would be offering four prototyping runs for its advanced 0.18µm High-Voltage CMOS technology H18. The H18 process technology is based on IBM’s industry proven 0.18µm CMOS process CMOS7RF. In addition, four MPW runs for foundry customers are available in the CMOS7RF base technology.

For the 0.35µm processes which are based on the 0.35µm CMOS process transferred from TSMC, a total of fifteen runs are offered in 2010.

The advanced High-Voltage CMOS process with Embedded Flash functionality adds to austriamicrosystems’ MPW service portfolio. The CMOS compatible 0.35µm Silicon-Germanium BiCMOS technology S35 enables RF circuit designs with an operating frequency of up to 10 GHz combined with high-density digital parts on one single ASIC.

Lead-times were said to be approximately 8 weeks for CMOS and 10 weeks for 0.35µm High-Voltage CMOS, SiGe-BiCMOS and Embedded Flash processes.

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