ASML has joined SEMATECH’s Lithography program at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex to further develop EUV lithography to ensure its future adoption. ASML already partners with IMEC on EUV technology and infrastructure development. CNSE also has an ASML built EUV ‘Alpha’ tool.
“This partnership combines ASML’s vast array of technical expertise and recognized leadership in the industry with SEMATECH’s experience in building infrastructure for next-generation lithography technologies,” said John Warlaumont, SEMATECH’s vice president of advanced technology. “We share a commitment to keep EUVL on track for cost-effective high volume manufacturing, and will work together to continue the progress being made in EUV technology development to enable pilot and production lines.”
“As a single exposure solution and extendible technology, EUV provides the most cost-effective lithography for volume production of sub-3xnm devices,” said Ron Kool, Vice President of EUV Lithography Systems at ASML. “Our collaboration with SEMATECH and CNSE demonstrates the industry’s commitment to EUV technology and the infrastructure necessary to extend semiconductor shrink for another decade or more.”
Key collaboration between researchers from both enterprises will focus on including mask defect reduction, mask metrology infrastructure, source development, resist and materials development, and overall manufacturability and extendibility.