Already a member of numerous advanced packaging programs, especially related to 3D IC packaging technology, Applied Materials is also establishing a Center of Excellence in advanced packaging in Singapore in joint collaboration with the Singapore Agency for Science, Technology and Research (A*STAR). The center will be located at Singapore’s Science Park II and will focus on developing new capabilities in advanced packaging which has long been touted as a key growth market for the semiconductor industry.
Last year, Applied Materials opened its Singapore Operations Center, its first facility in Asia for manufacturing advanced semiconductor equipment, at Changi North Industrial Park.
“This collaboration is part of Applied Materials’ strategy to expand our global R&D network and extend our leading position in advanced packaging, bringing our development activities closer to our customers in Asia,” commented Russell Tham, Regional President, Applied Materials South East Asia.
Applied noted that it expected many advanced logic devices at the 40nm and below technology nodes to be packaged at the wafer level.
According to Professor Dim-Lee Kwong, Executive Director of IME, leading research institute with advanced R&D capabilities in 3D-ICs using TSV technology, said “The Center is an excellent example of strategic partnerships fostered between two critical players in the global semiconductor value chain. Such a close collaboration will spur the growth of next generation equipment and translate into greater share of the semiconductor market in Asia and the world for Applied Materials, and position Singapore as the country of choice for global semiconductor R&D.”