Online information source for semiconductor professionals

Applied Materials has joined the international EMC-3D semiconductor equipment and materials consortium as part of its efforts to develop cost-effective and manufacturable through-silicon via (TSV) process flows for 3D chip stacking and MEMS integration.

"Applied Materials sees the TSV approach as an important enabling technology for tomorrow's sophisticated image sensors, memory and mixed-signal applications," said Hans Stork, group vice president and CTO of Applied's Silicon Systems Group. "Joining forces with other leading equipment and materials suppliers is an effective way to qualify contiguous processes, drive down the cost and enable the widespread adoption of TSV technology. By deploying fabrication equipment, materials and process technology from the EMC-3D member companies, our customers can take advantage of a complete, validated process flow, greatly reducing their own development time and initial investment."

"EMC-3D is currently at the mid-point of a three-year objective to bring cost-effective TSV to market,” noted Paul Siblerud, EMC-3D chairman and vice president of marketing at Semitool “Each member is addressing the technical integration challenges of TSV technology for chip stacking and advanced MEMS/sensors packaging."

The original goal of the consortium was to create a robust integrated process flow at a cost of less than US$200 per wafer but that led to a via-first  and via-last process flow at a total cost of ownership (CoO) of under US$150.