Fujitsu Microelectronics has signed a service contract with Applied Materials for its 300mm fab in Mie Prefecture, Japan. The contract call for normal services of more than 100 of Applied’s tools at the facility as well as the implementation of its ‘E3’ advanced process control technology to the fabs complete toolset. Applied’s E3 technology includes fault detection and classification (FDC).
“The SoC market requires a high degree of application-specific customization, resulting in a constantly changing product mix. Maintaining tight process control on every wafer is critical to profitability,” said Kiyoshi Watanabe, Corporate Vice President, Fujitsu Microelectronics Ltd. “The Applied Performance Service Program paces service and price to actual utilization rates to provide us with committed uptime performance at a low, predictable cost that tracks factory loading.”
Fujitsu has two 300mm fabs in Mie, Japan. The most recent was completed in 2007 and had a maximum capacity of 25,000wspm.