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Applied Materials and DISCO team on TSVs

30 March 2009 | By Mark Osborne | News > Wafer Processing

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Applied Materials is continuing its assault on 3D-semiconductor technology with the announcement that it plans to collaborate with equipment supplier, DISCO Corporation to develop wafer-thinning processes for fabricating through-silicon vias (TSVs). The target is remains focused on integrated, high-performance process flows that reduce costs for adopting the technology.

“We’re pleased to work with DISCO to advance this exciting and disruptive technology,” said Hans Stork, Group Vice President and Chief Technology Officer of Applied’s Silicon Systems Group. “Our strategy to collaborate with DISCO and other leading equipment suppliers is an innovative way of doing business that can deliver robust solutions to mitigate our customers’ risk and lower the overall cost of device fabrication on ultra-thin substrates.”

“The alliance of Applied’s process integration expertise and our leading wafer-thinning systems is great news for chipmakers planning to use TSV technology,” said Nobukazu Dejima, President of DISCO HI-TEC America, Inc. “The capability to validate complete process flows using thinned wafers at our Santa Clara research laboratory and Applied’s Maydan Technology Center gives us a unique opportunity to exploit the advantages of thinned wafers in multiple TSV integration schemes.”

The technology partners expect to develop wafer-thinning and post-thinning processes of wafers that are bonded to silicon and glass carriers. Solutions are required for wafer structural and edge integrity, particle control, stress management and thermal profile control before the technology can be adopted in volume low-cost packaging production.

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