Online information source for semiconductor professionals
Analog Devices lowers analog production costs
Popular articles
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
Improvements to its fab in Wilmington, Massachusetts and Limerick, Ireland, have led to higher utilization, shorter lead times and lower manufacturing costs for Analog Devices. The Limerick fab has transitioned all production 200mm wafers, while its Wilmington fab has made a range of operational improvements to lower cost and achieve greater wafer fabrication efficiencies for its proprietary analog, mixed-signal, and MEMS manufacturing process technologies.“We were able to achieve the right balance between internal and external manufacturing, which allowed ADI to maintain short, consistent lead times and strong delivery performance throughout the facility upgrade process. Many thanks go to the hard working teams in our manufacturing and planning organizations who ensured these major improvements went smoothly during a challenging year,” said Robbie McAdam, Vice President of the Core Products and Technologies group, Analog Devices. “Our accelerated schedule ensures we have the staff, equipment, and clean room capacity to help our global customers meet their upside demand without running the risk of supply chain interruptions.”
Competitor, Texas Instruments is making the further cost reduction step by moving some of analog production to 300mm wafers over the next year, using its Richardson, Texas fab.
Other such as Analog Devices, are using foundries with 300mm capacity for cost sensitive products.