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AMD launches its eighth annual Global Climate Protection Plan

29 October 2008 | By Syanne Olson | News > EHS

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AMD unveiled its eighth annual Global Climate Protection Plan (GCPP) that summarized the company’s continuing strategy and goals to maximize energy efficiency, help lower costs and minimize its environmental impact. This year, the GCPP increased its reporting levels to include analysis and data on new initiatives and projects. It also lays out how AMD has once again committed to reduce its normalized greenhouse gas emissions by 33 percent and normalize energy usage by 40 percent by 2010, relative to a 2006 baseline year. The company surpassed its commitment for 2002-2007 to reduce normalized greenhouse gas emissions in its operations by 40 percent and normalized energy usage by 30 percent.

“By continuing to expand and share AMD’s climate change strategy and performance metrics with the general public, governments, suppliers, industry groups, and the scientific community, AMD is enabling others to benefit from our experiences as we learn from theirs,” said Dirk Meyer, President and Chief Executive Officer, AMD. “Transparency and collaborative innovation are hallmarks of AMD’s approach to global climate protection, and represent a fusion of our efforts married to the industry’s best practices, such as supply chain accountability.”

AMD has also begun, for the first time, to quantify and estimate its Scope 3 emissions gas production. The Greenhouse Gas Protocol selects indirect emissions associated with supply chain, product distribution, employee business travel and commuting in the Scope 3 category. With this in mind, AMD is able to connect more directly with its supply chain on the suitable metrics, goals and strategy to limit the company’s end-to-end carbon footprint, as well as form a more complete view of the global environment implications of its activities and business model.

Fab 30 and Fab 36, AMD’s wafer fabrication operations in Dresden, Germany, are powered by trigeneration Energy Centers, EVC1 and EVC2. As AMD continues to change the 200mm Fab 30 to the 300mm Fab 38, EVC1 has been upgraded to attain a thermal efficiency of roughly 80 percent, a more than 10 percent improvement, while EVC2 reaches efficiencies of almost 84 percent. The Dresden Fabs have significantly low emissions of perfluorcompounds (PFCs), which allow the company to reduce its absolute PFC emissions by more than 95 percent below 1995 levels.

2007 saw AMD’s manufacturing operations in Dresden, Singapore, Penang, Malaysia and Suzhou, China sustaining energy efficient improvements and contributing to a 20 percent worldwide reduction in AMD’s normalized energy consumption relative to the 2006 baseline. The company’s dedication to energy efficiency and environmental stewardship in manufacturing operations is demonstrated in the conceptual design for the planned wafer fabrication facility at the Luther Forest Technology Campus in Saratoga County, New York.

Earlier this month, AMD and Advanced Technology Investment Company (ATIC) of Abu Dhabi, publicized their joint creation of The Foundry Company. This U.S. headquartered, leading-edge semiconductor manufacturing company addresses the demand for independent, leading-edge foundry production ability by combining advanced process technology, manufacturing facilities and strong plans to expand its global capacity footprint using AMD’s success as a model.
 

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