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Allvia scores additional $5 million in funds to expand TSV foundry operations

04 February 2009 | By Tom Cheyney | News > Wafer Processing

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allvia_fabThrough-silicon via foundry Allvia has secured $5 million from private investors in its latest round of funding. The Sunnyvale, CA-based company says it will use the funds to expand its manufacturing facilities and build more capacity. The new monies bring the total invested in the company to $25 million.
Allvia has been producing TSVs for more than five years, providing development work for advanced vertical interconnects and system-in-package (SiP) solutions. For the past three years the company has generated revenue with its TSV work. With in-house processing equipment, a long history of intellectual property, and a fabrication facility, the foundry offers prototyping services and volume production runs.
"For the past five years we have been developing the reliability data, the costing, and the manufacturability parameters of through-silicon vias," said CEO Sergey Savastiouk. "Those three elements are the keys to transporting TSVs from niche to volume production. What we see in the marketplace is that some companies which started their own TSV development some time ago find it difficult to continue development in this downturn environment, and they are coming to Allvia to benefit from existing operations."

"As a technology TSVs are going through a similar life-cycle as flip chips," continued Savastiouk. "Flip chips were first developed in the 1960s by IBM. But it took decades to develop the feasibility, reliability, cost effectiveness and manufacturability to get them into volume production.

"TSV has passed the feasibility phase, but reliability and manufacturability figures, and most importantly, those applications that are willing to pay for the technology, are still being determined."

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