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Aixtron, Ovonyx team on AVD processes for phase-change memory

20 January 2009 | By Mark Osborne | News > Wafer Processing

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AIXTRON and Ovonyx team on AVD processes for Phase Change MemoryUsing Aixtron's atomic vapor deposition technology, which features the pulsed injection of liquid precursors for precise deposition, Aixtron and Ovonyx plan to develop the second-generation deposition technology required for the scaling of phase-change memory (PCM). According to the companies, physical vapor deposition (PVD) processes will be used for the initial production ramp of PSM devices.

"PCM is on the verge of commercial adoption using conventional sputter physical vapor deposition techniques, however, it is clear that subsequent generation PCM cells would significantly benefit from atomic vapor deposition of phase-change materials to further increase scalability and accelerate cost reductions," said Dr. Bernd Schulte, executive vice president and chief operating officer of Aixtron. "We believe that, working with Ovonyx, we can accelerate commercialization of AVD phase-change material deposition into high-volume production and offer chip manufacturers higher productivity and low cost of ownership solution."

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