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3M upgrades R&D lab with CMP tools and inspection equipment

15 July 2011 | By Mark Osborne | News > Cleanroom

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In conjunction with opening new CMP pad operations in Taiwan and expanded production in Singapore, 3M has also expanded its development laboratory and cleanroom located at its headquarters in Saint Paul, Minn. The expansion includes a 300mm CMP tool and defect metrology for product and application development. This makes 3M the only pad conditioner supplier to have in-house capabilities for 300mm wafer testing and wafer defect inspection.

3M said it had selected Applied Materials 300mm Reflexion CMP tool due to the fact it enables the company to simulate its customers’ 300mm process conditions for developing and testing new CMP pad conditioners and fixed abrasive products. In addition, a KLA-Tencor Surfscan SP2 wafer inspection tool was also selected as it gives 3M in-house capabilities to develop new CMP consumables that have ultra-low defect performance for the most advanced semiconductor processes.

“The addition of the 300mm CMP tool and the Surfscan SP2 wafer inspection tools demonstrate 3M’s continued commitment to providing the semiconductor industry with new and innovative materials,” said Dr. Philip Clark, laboratory manager for 3M. “With these new capabilities we are able to help customers implement process enabling pad conditioner solutions faster for even the most advanced process nodes.”

According to 3M it is the only pad conditioner supplier to have in-house capabilities for 300mm wafer testing and wafer defect inspection.

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