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3M and SUSS MicroTec team on ultrathin wafer bonding

23 June 2009 | By Mark Osborne | News > Wafer Processing

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A new partnership between SUSS MicroTec and 3M has been formed to provide process solutions and materials for the temporary wafer bonding process for wafer thinning and processing of ultra thin wafers for 3-D packaging. SUSS MicroTec becomes an authorized equipment supplier for the 3M Wafer Support System (WSS) equipment and will manufacture and sell XBC300 and CBC300 wafer bonders configured to use 3M’s WSS materials. The deal is non-exclusive agreement.

“SUSS MicroTec is a recognized leader in wafer bonding and applications for 3-D and MEMS markets. Working with an industry leader, like SUSS, allows 3M to focus on advanced materials development. The joint efforts of both companies provide 3M customers with improved support, lower overall costs and faster access to more advanced solutions for their demanding 3-D packaging requirements,” commented Mike Bowman, marketing development manager for 3M Electronics Markets Materials Division.

The partners said the arrangement would meet customer demand for high-volume manufacturing solutions that provided a competitive cost of ownership.

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