Online information source for semiconductor professionals

A major Asian memory manufacturer has placed an order with SUSS MicroTec Test Systems for a 300mm wafer-level probe system, the PA300PS. The decision follows a six-month, head-to-head comparison against the incumbent and major competition for wafer-level test solutions at the manufacturer’s facilities, the company said. The system will be used for IC device characterization and reliability testing. Read more >>

In a move aimed to bolster Dresden's role as a center of excellence for advanced photomask development and engineering, the German Federal Ministry of Education and Research (BMBF) is funding a portion of a new joint venture in the area. Over the next two and a half years, the "Critical Dimension and Registration for 32-nm Mask Lithography" (CDuR32) cooperative project--a partnership of the Advanced Mask Technology Center (AMTC), Vistec Semiconductor Systems, and the German Metrology Institute (PTB)--will develop mask and measurement technologies for 32-nm memory chip and 22-nm microprocessor generations. Read more >>

Strong demand for semiconductors, especially from the consumer markets is allowing IC manufacturers to retain high fab utilization rates, according to the latest figures from the SIA. Overall capacity utilization is at 89 percent in July, 2008 with leading edge utilization rates above 95 percent. The SIA also reported that for the first time, 300mm wafer production accounts for the largest share of wafer manufacturing capacity and actual wafers processed, with 44 percent of total capacity and 47 percent of total silicon processed. Read more >>

A major European semiconductor manufacturer has ordered two ‘WaferWoRx’ 300 Probing Process Analysis Systems from Rudolph Technologies. The orders were placed as part of a multi-tool agreement signed in June 2008. Read more >>

Cymer has come out with a argon-fluoride laser light source designed for advanced "dry" lithography--the XLR 500d. The company says the new source leverages the advanced capabilities of its XLRE technology developed for ArF immersion lithography, including enhanced energy stability, which enables the use of fewer laser pulses per exposure, providing semiconductor manufacturers with higher throughputs and decreased operating costs. Read more >>

PDF Solutions is to acquire Triant Holdings for $1.75 million in cash, which includes existing customer contracts, technologies and employees. Applied Materials had acquired a 12.5 percent equity in Triant Technologies for an investment of $2.2 million in 1999. Triant is known for its fault detection software technology. Read more >>

Hynix Semiconductor has officially opened its latest 300mm fab, dubbed M11 in Cheongju, Korea. The new 200,000wspm plus facility is Hynix’s largest facility and will be dedicated to NAND flash production starting in September, 2008. Initially, M11 will be ramped to 40,000wspm using Hynix’s 40nm process technology, producing 16Gb and 32Gb flash memory devices. Read more >>

Three leading semiconductor manufacturers in Europe have placed orders for Aviza Technology’s 200mm and 300mm Omega fxP etch systems as well as its deep silicon (DSi) etch modules. The systems will be sued for consumer, automotive and related end market applications, the company said. Aviza said that one of the tools is a follow-on order. Read more >>

Lam Research has opened a new 3,600-plus square foot facility in Hsinchu, Taiwan that will become Lam’s global center for customer training, related to its 200mm and 300mm etch processing tools. Read more >>

In a surprising move SEMI Europe has decided to move the location of it’s annual gathering to Dresden. Having only just moved to Stuttgart last year it appears that 2008 marks the last time that the new Stuttgart venue will be used. Read more >>