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Tool Order: EV Group ships IQ Aligner system to Asahi Kasei Group

06 December 2011 | Wafer Processing
EV Group's IQ AlignerWafer bonding and lithography equipment supplier EV Group has been tapped for one of its tools by Asahi Kasei E-Materials Corp. EV Group has shipped an IQ Aligner UV nanoimprint lithography (UV-NIL) system to the company, which will use the tool for development of materials for high-resolution wafer-level optics. Read more >>

IHS cuts semiconductor forecast to 1.2%

17 November 2011 | Fab Management
Rare to see a semiconductor forecast in this very low range, market research firm, IHS has revised 2011 figures to indicate growth of barely 1.2%, down from its previous forecast in September of 2.9%. Apparently, the lowered figure is still something the industry should take a positive considering the wider macro economics at the moment, according IHS. IHS noted that the primary market weighing down the semiconductor market is memory. DRAM, SRAM, NOR Flash memory—along with digital signal processors – are expected to generate revenue declines of 15% or more in 2011 and not much better in 2012 as all segments including NAND flash memory are projected to decline.
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Precipitous drop in semiconductor equipment bookings in September

21 October 2011 | Wafer Processing
Bookings took a bashing in September, according to the latest monthly book-to-bill figures released by SEMI. North America-based manufacturers of semiconductor equipment booked only US$984 million in the month, down from US$1.162 billion in August, continuing a rapid decline that started in June, 2011. The bookings figure is 15.3% less than the final August 2011 level and is 40.4% below the US$1.65 billion in orders posted in September 2010. The decline in bookings on a quarter-to-quarter bases is approximately US$1.32 billion. Read more >>

Imec and ASML team on next-generation lithography for another 5 years

10 October 2011 | Lithography
One of the longest technology partnerships in the semiconductor industry is set to get longer after both imec and ASML agreed to extend work on both immersion and EUVL development, for a further 5 years. The agreement follows installations at imec’s 300mm R&D facility with ASML’s NXT1950i immersion tool and its NXE:3300B, the successor of ASML’s NXE:3100 preproduction tool that has been installed at imec, earlier this year. Read more >>

Japan helps lacklustre semiconductor sales growth in August

03 October 2011 | Fab Management
Semiconductor manufacturing recovery in Japan and the subsequent boost to overall semiconductor sales helped slightly in August, according to the latest SIA monthly figures. Worldwide sales of semiconductors were US$25.03 billion in August, up 0.7% from the prior month when sales were US$24.9 billion and basically flat since June figures were released. Read more >>

Tool Order: Rudolph ships multiple TSV inspection and metrology systems

03 October 2011 | Wafer Processing
Rudolph Technologies has shipped its ‘Wafer Scanner 3880 3D Inspection System,’ multiple ‘NSX’ Macro Defect Inspection Systems and its ‘Discover’ Yield Management Software Suite to a leading semiconductor manufacturer. The customer will use the systems for developing through silicon via (TSV) based processes for advanced 3D IC integration. Read more >>

Tool Order: Six customers now adopted FSI’s ‘ORION’ single wafer cleaning system

30 September 2011 | Wafer Processing
A leading Asian foundry producer has given FSI International final acceptance of an ‘ORION’ single wafer cleaning system, marking the sixth customer that has adopted the platform and technology. The latest customer qualified the system for 28nm FEOL processes and will use it for all-wet photoresist stripping applications using the high-temperature ‘ViPR’ process. FSI said it expects to recognize revenue for this system in the first quarter of fiscal 2012. Read more >>

Amkor to purchase Toshiba’s Malaysian IC assembly and test operations

30 September 2011 | Cleanroom
Toshiba said it would continue to subcontract power semiconductor assembly and test to its former Malaysian IC assembly and test operations after being acquired by Amkor. Toshiba and Amkor expect to complete the transaction by early January 2012. Read more >>

Gartner cuts semiconductor capital spending forecast

30 September 2011 | Wafer Processing
The usual suspects of slowing global economic growth and excess inventory have set the backdrop for Gartner to completely revise is 5-year CapEx forecast for the semiconductor industry. The slowdown in spending has already started and will decline by 19.2% in 2012 with equipment spending expected to total US$35.2 billion in 2012. Overall capital spending will decline 16.7% next year to US$51.5 billion, down from US$61.8 billion in 2011. Read more >>

Tool Order: RAVE wins multi-system order for reticle haze removal

20 September 2011 | Lithography
A major independent device manufacturer has placed a multi-system purchase order with RAVE for its ‘Rhazer’ haze removal systems for reticles. The orders were given after an extensive in-fab evaluation of the Rhazer haze removal technology, according to RAVE. Read more >>