
Wafer bonding and lithography equipment supplier EV Group has been tapped for one of its tools by Asahi Kasei E-Materials Corp. EV Group has shipped an IQ Aligner UV nanoimprint lithography (UV-NIL) system to the company, which will use the tool for development of materials for high-resolution wafer-level optics.
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Rare to see a semiconductor forecast in this very low range, market
research firm, IHS has revised 2011 figures to indicate growth of barely
1.2%, down from its previous forecast in September of 2.9%. Apparently,
the lowered figure is still something the industry should take a
positive considering the wider macro economics at the moment, according
IHS. IHS noted that the primary market weighing down the semiconductor market
is memory. DRAM, SRAM, NOR Flash memory—along with digital signal
processors – are expected to generate revenue declines of 15% or more in
2011 and not much better in 2012 as all segments including NAND flash
memory are projected to decline.
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Bookings took a bashing in September, according to the latest monthly
book-to-bill figures released by SEMI. North America-based manufacturers
of semiconductor equipment booked only US$984 million in the month,
down from US$1.162 billion in August, continuing a rapid decline that
started in June, 2011. The bookings figure is 15.3% less than the final
August 2011 level and is 40.4% below the US$1.65 billion in orders
posted in September 2010. The decline in bookings on a
quarter-to-quarter bases is approximately US$1.32 billion.
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One of the longest technology partnerships in the semiconductor industry
is set to get longer after both imec and ASML agreed to extend work on
both immersion and EUVL development, for a further 5 years. The
agreement follows installations at imec’s 300mm R&D facility with
ASML’s NXT1950i immersion tool and its NXE:3300B, the successor of
ASML’s NXE:3100 preproduction tool that has been installed at imec,
earlier this year.
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Semiconductor manufacturing recovery in Japan and the subsequent boost
to overall semiconductor sales helped slightly in August, according to
the latest SIA monthly figures. Worldwide sales of semiconductors were
US$25.03 billion in August, up 0.7% from the prior month when sales were
US$24.9 billion and basically flat since June figures were released.
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Rudolph Technologies has shipped its ‘Wafer Scanner 3880 3D Inspection
System,’ multiple ‘NSX’ Macro Defect Inspection Systems and its
‘Discover’ Yield Management Software Suite to a leading semiconductor
manufacturer. The customer will use the systems for developing through
silicon via (TSV) based processes for advanced 3D IC integration.
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A leading Asian foundry producer has given FSI International final acceptance of an ‘ORION’ single wafer cleaning system, marking the sixth customer that has adopted the platform and technology. The latest customer qualified the system for 28nm FEOL processes and will use it for all-wet photoresist stripping applications using the high-temperature ‘ViPR’ process. FSI said it expects to recognize revenue for this system in the first quarter of fiscal 2012.
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Toshiba said it would continue to subcontract power semiconductor
assembly and test to its former Malaysian IC assembly and test
operations after being acquired by Amkor. Toshiba and Amkor expect to
complete the transaction by early January 2012.
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The usual suspects of slowing global economic growth and excess
inventory have set the backdrop for Gartner to completely revise is
5-year CapEx forecast for the semiconductor industry. The slowdown in
spending has already started and will decline by 19.2% in 2012 with
equipment spending expected to total US$35.2 billion in 2012. Overall
capital spending will decline 16.7% next year to US$51.5 billion, down
from US$61.8 billion in 2011.
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A major independent device manufacturer has placed a multi-system
purchase order with RAVE for its ‘Rhazer’ haze removal systems for
reticles. The orders were given after an extensive in-fab evaluation of
the Rhazer haze removal technology, according to RAVE.
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