Online information source for semiconductor professionals


SUSS MicroTec and GenISys team on mask aligner optimization

21 February 2012 | Lithography
In a bid to enable easier modelling of large numbers of different source shapes, SUSS MicroTec and GenISys are teaming to jointly offer their products for mask aligner equipment. The cooperation means that GenISys’ ‘Layout LAB’ has been enhanced to accurately model all available SUSS MicroTec mask aligner exposure optics, including the SUSS MO Exposure Optics technology. Read more >>

Applied Materials expects wafer fab equipment spending above US$30 billion

20 February 2012 | Wafer Processing
Despite overcapacity in key markets such as DRAM, wafer fab equipment spending is projected to be above US$30 billion in 2012, according to Applied Materials. Mike Splinter said in a conference call to discuss quarterly results last week that FEOL capital spending in 2011 actually exceeded its previous forecast, ending the year at approximately US$35 billion. Spending on lithography equipment were said to reached  record highs as memory makers implemented device shrinks by upgrading lines with 193 ArF immersion systems. Read more >>

TSMC keeps spending on facilities and front-end fab equipment

20 February 2012 | Wafer Processing
Leading semiconductor foundry, TSMC has placed official orders valued at over US$300 million in the last 4-weeks, bringing the total in 2012 to approximately US$600 million. According to Applied Materials chairman and chief executive officer, Mike Splinter in conference call to discuss quarterly results, foundries were spending on leading-edge technology as they met demand for smart phone IC applications and will be a key driver of capital expenditure, notably in the first-half of 2012. Read more >>

SPIE 2012: Gigaphoton hits 7 watts of EUV power with production LPP light source

13 February 2012 | Lithography
Gigaphoton is contining its development program to achieve an output of 250W for its laser-produced plasma (LPP) light source, while confirming that its laser-produced plasma (LPP) light source, scheduled to be shipped in 2012, generated 7 watts of EUV power. According to ASML’s EUV roadmap, a 20W light source would be required by the end of 2011. Competitor, Cymer said in the third quarter of 2011 that it was shipping an 8W LLP upgrade to customers with a 20W source ready by the end of the year, yet in its 1Q12 conference call, accepted that this milestone had been delayed. Read more >>

SPIE 2012: Imec touts ‚??Directed Self-Assembly‚?? process to support 193nm and EUV lithography

13 February 2012 | Lithography
Perennial push-outs of EUV lithography and continued reliance on 193nm immersion technology have opened the way for technologies to supplement inherent challenges for both. Not only is E-beam lithography gaining attention again but imec believes a ‘Directed Self-Assembly’ process not only has the potential to tackle small feature formation but provide a low-cost approach, lacking in the pursuit of ever-decreasing feature sizes. Kicking of the SPIE Advanced Lithography conference, imec said it had established the world first 300mm fab-compatible Directed Self-Assembly (DSA) process line at its 300mm R&D facility in Leuven, Belgium. Read more >>

Order Focus: Singulus receives two orders for Timaris vacuum deposition system

08 February 2012 | Wafer Processing
Singulus' Timaris systemSingulus Technologies has won two new orders for its Timaris deposition coating machine from an unnamed source. The company expects this to be the start of a good year for shipments of such tools, as nano-coating technology for MRAM wafers and thin-film read/write heads are becoming more and more popular among wafer manufacturers. Read more >>

Order Focus: Veeco ships TurboDisc MOCVD tool to LG Siltron

08 February 2012 | Wafer Processing
Veeco's TurboDiscVeeco Instruments has revealed that it has received an order for one of its TurboDisc MOCVD tools from South Korean epi wafer manufacturer, LG Siltron. The TurboDisc tool is a K465i gallium nitride MOCVD system for production of gallium nitride on silicon (GaN-on-Si) wafers for power electronics and LED devices. Read more >>

Silicon wafer revenues climb as shipments fall

07 February 2012 | Materials and Gases
Unlike the PV industry that has seen wafer prices decline by as much as 70% in 2011, semiconductor silicon wafer revenue actually increased by 2%, while shipments decreased 3%. Though SEMI Silicon Manufacturers Group (SMG) didn’t say why shipments were lower but revenue higher, consolidation in the market coupled to the continued migration to 300mm wafers at the expense of smaller sized substrates could be the key underlying reason for the trends in 2011. Read more >>

Gigaphoton‚??s GT63A next-gen ArF excimer laser ready for shipment in Q2‚??12

07 February 2012 | Lithography
Gigaphoton's GT62AGigaphoton has added to its immersion lithography product range with the GT63A, a next-generation ArF excimer laser for multi-patterning immersion lithography scanners. The company has announced that the new product, which has been developed in response to customers’ needs and requests, will be ready for shipment in the second quarter of 2012. Read more >>

Rudolph ships first MetaPULSE system for under-bump metallization processes

07 February 2012 | Wafer Processing
MetaPULSEProcess characterization equipment supplier Rudolph Technologies has entered the back-end packaging sector of the semiconductor industry with its first shipment of its MetaPULSE metrology system. The shipment took place in Q4’11 to an unnamed customer, said to be a major IC manufacturer, and the tool has since been installed at the customer’s site. Read more >>