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Tool Orders: New chip company orders metal deposition tool from Trikon

15 September 2005 | Wafer Processing
A new power semiconductor fabrication facility based in Asia has ordered Trikon Technologies, Sigma fxP metal deposition cluster tool. The first Sigma fxP system to ship to the new fabrication facility will provide contact/barrier and interconnect layers onto power management devices. Barrier layers will be deposited using Hi-Fill; Trikon's patented barrier deposition module that achieves increased film thickness at the base of deep contact holes. For interconnect, thick aluminum layers will be deposited at high rate in modules with very low maintenance schedules. Read more >>

Philips starts 90nm production

15 September 2005 | Wafer Processing
Royal Philips Electronics said yesterday that it has ramped three key 90-nm CMOS products into volume production at the Crolles2 Alliance wafer fab in Crolles, France. The three Philips products, one of which is already shipping at more than 1 million pieces per month, are baseband chips. The company plans to migrate volume production to TSMC as part of the outsourcing strategy and technology alignment program in place when Crolles2 was started. Read more >>

Research project to develop new imaging technique

15 September 2005 | Wafer Processing
Innos, and Queen Mary College London, are starting a project funded by EPSRC to investigate the potential of Scanning Photo-induced Impedance Microscopy (SPIM) for a range of characterization applications that span semiconductor to biotech.
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Tool Order: European fab orders GAMA Clean wet station for MEMS production

13 September 2005 | Wafer Processing
A major IC & MEMS semiconductor company based in Europe has ordered a GAMA/i-clean front-end-of-line (FEOL) cleaning tool valued at over  $1.5 million, from Akrion, Inc. The tool, which will be used for a MEMS production application, is being installed as part  of the customer's fab expansion, according to the company. The system includes an i-clean module, which minimizes footprint and enhances particle performance by combining six process steps into one tank: SC1, SC2 and dilute HF chemistries with their associated rinses. The latest addition to the GAMA Series product line, the i-clean module also uses megasonic-aided rinsing to reduce cycle time. Read more >>

Tool Order: Therma-Wave awarded multi-million deal for thin-film measurement tools

13 September 2005 | Wafer Processing
A commodity IC manufacturer has placed a multi-million dollar, multi-tool order for Therma-Wave's "Opti-Probe" thin-film measurement tool. The follow-on order will be used for 90nm production applications as well as 45nm development work in Litho, Diffusion, and Etch applications, according to the company. Read more >>

Tool Orders: ProMOS in follow-on orders with Mattson

12 September 2005 | Wafer Processing

ProMOS Technologies has awarded Mattson Technology with follow-on orders for its Aspen III ICPHT and Helios RTP systems. The systems are scheduled to begin shipment in September and will be used in ProMOS' 300 mm Fab 3 at Central Taiwan Science Park (CTSP) for the volume production of advanced memory devices, including 512 Mb and 1 Gb DDR2 DRAM stacked capacitors with 90 nm technology. Read more >>

Memory could be transformed by spin!

12 September 2005 | Wafer Processing
Researchers from Imperial College London, Durham University and the University of Sheffield say their new computer chip design will enable large amounts of data to be stored in small volumes by using a complex interconnected network of nanowires, with computing functions and decisions performed at the nodes where they meet a similar approach to neurons and axons in the brain. Read more >>

SEMATECH starts extension work on immersion lithography

09 September 2005 | Wafer Processing
SEMATECH has received a key tool for exploring the extension of immersion lithography to produce advanced semiconductors at the 45nm half-pitch lithography generation and beyond, according to the R&D centre on September 1st. The tool, an interference immersion exposure system from Amphibian Systems, will be placed in the Immersion Technology Center (iTC), which focuses on extending immersion lithography beyond pure water-based approaches. Read more >>

Moore in meeting on Moore!

09 September 2005 | Wafer Processing
Gordon Moore is to present a speech at Computer History Museum on September 29 in Mountain View CA. The evening presentation is part of the Museum's Computer History Museum Presents Speaker Series, an exclusive platform for open discussions for presenting the computing revolution and its impact on us.Read more >>

Moore in meeting on Moore!

09 September 2005 | Wafer Processing
Gordon Moore is to present a speech at Computer History Museum on September 29 in Mountain View CA. The evening presentation is part of the Museum's Computer History Museum Presents Speaker Series, an exclusive platform for open discussions for presenting the computing revolution and its impact on us. Read more >>