Online information source for semiconductor professionals

aCymer, Inc. has announced the industry’s first purchase of two of its 90W ArF XLR 600i light sources for applications in volume immersion and double patterning lithography at the 32nm node and beyond. The tool was demonstrated in April at Nikon’s Kumagaya, Japan facility, and it is believed that the tools were purchased by Nikon following the successful demonstration of its abilities and applications. Read more >>

Asyst Technologies has announced its receipt of a tool order to the value of approximately $15 million over a 12-18 month implementation period.. The order, which comes from an unnamed major IC manufacturer, will see the installation of Asyst’s Spartan Integrated Sorter in four different fabs, replacing equipment installed by a rival in the same locations, according to the company. Read more >>

Rohm and Haas Company has entered into an agreement with The Dow Chemical Company for the acquisition by Dow of all of the outstanding shares of Rohm and Haas common stock for $78.00 per share in cash. Taking into account the approximately 196 million shares held by Rohm and Haas as of April 22nd 2008, the estimated transaction price is over $15 billion. Read more >>

NexPlanar Corporation has announced its completion of a $14.5 million round of financing that will enable them to market and commercialize its new CMP pad technology. The company uses proprietary "nano-domain" technology, which, according to the company, improves planarity, across-wafer uniformity and the most advanced CMP applications. Read more >>

In an attempt to meet the increasing demand for high-purity silane gas in the PV and related industries, the Linde Group and Schmid Silicon Pilot Production have decided to collaborate on silane production via the joint ownership of a new facility in Dresden, Germany. The silane produced at this facility will contribute towards the current capacity for Linde’s customers and will be based on the new Schmid Monosilane Technology process. Read more >>

In a revision of its April forecast of a 19.8 percent decline in worldwide capital equipment spending, Gartner, Inc. has forecast a 22.4 percent decrease from spending levels seen in 2007. The market research company have estimated that spending for the year will amount to approximately $49.2 billion and that the decline is a result of oversupply in the DRAM and NAND flash memory segments. Read more >>

Numonyx and Elpida Memories have signed a letter of intent to enter into a foundry agreement that would see Elpida fabricate 65nm NOR flash devices at its 300mm wafer fab in Hiroshima, starting in mid-2009. The agreement is expected to be finalized in the current quarter and also includes 45nm production, though Numonyx did not say whether this would also include its phase-change memory devices at that node, revealed earlier this year by the company. Read more >>

Semiconductor R&D and engineering costs are rising at a faster rate than IC sales, according to a new report from IC Insights. R&D and engineering expenditures increased at a compound average growth rate (CAGR) of 12.7 percent between 1990 and 2007, while semiconductor sales grew at a CAGR of 9.9 percent in the 17-year period. Read more >>

WIN Semiconductors Corporation has placed a multiple system order with Aviza Technology, consisting of Sigma fxP PVD, Delta fxP CVD, Omega fxP and i2L etch systems. The tools will be used for various process technologies required to fabricate GaAs devices. Shipments will be completed in the fourth quarter of Aviza’s Fiscal Year 2008. Read more >>

Replisaurus Technologies has installed a SUSS MicroTec Gamma coating cluster that will be used for the development of Replisaurus’ ElectroChemical Pattern Replication (ECPR) technology and process applications.

 

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