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IMEC is to use Synopsys TCAD (Technology Computer-Aided Design) finite-element method tools for characterizing and optimizing the reliability and electrical performance of through-silicon vias (TSVs) as part of the nano-electronics research centre’s to accelerate development efforts.
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In the March update to The McClean Report, IC Insights is now forecasting that the worldwide IC market is expected to rebound 27% in 2010 to US$253 billion. At the beginning of the year, the market research firm expected a 15% growth over 2009, though had then suggested that should first quarter sales show any growth over fourth quarter 2009, then a 25% plus growth figure would occur. The first quarter is seasonally the weakest in a given year in the industry. IC Insights believes that preliminary data shows that the first quarter saw revenue grow 3% over fourth quarter figures. Read more >>

The small 0.3% rise in worldwide semiconductor sales in January, compared to December, 2009 may not seem significant at first glance. Seasonally, January is a weak month and normally figures of reported several percentage points lower than the previous month. With US$22.5 billion in sales in January and a slight increase over December, overall growth for the year is now expected to top 20% and that may well be a conservative figure when third quarter figures are eventually released. Read more >>

Continuing its long-term lithography technology partnership, TSMC is to take delivery of a TWINSCAN NXE:3100 EUV lithography system from ASML. Although pricing and delivery dates were not disclosed, TSMC said it would you the system for future advanced process node development, which is being conducted at its Fab 12 facility. ASML has now secured six customers for its EUV R&D tool. First shipments to some its customers could start in 2010. TSMC is also pursing e-beam lithography for future nodes, due to the inherent costs associated with EUV technology. A volume production EUV tool could cost in excess of US$50 million, according to market research firms. Read more >>

The next three years are set to be highly profitable for the major DRAM producers, according to the latest preliminary forecast figures from market research firm iSuppli Corp. DRAM revenue is expected to rise to US$31.9 billion in 2010, a 40.4 percent increase from US$22.7 billion achieved in 2009. However, 2010 is projected to be the peak in revenue earnings over the next four years, with the chance that 2013 could lead to losses for some as revenue is forecasted to fall to approximately US$26 billion. The yearly declines in revenue beyond 2010, is attributed to falling prices as new capacity gradually comes on stream. Read more >>

Citing strong demand across virtually all its market segments, which include semiconductor, LCD display and crystalline silicon solar, but not thin-film solar, Applied Materials expects FY2010 sales to be over 50% greater than the previous year. Applied had previously guided sales would increase by approximately 30%.
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Toshiba’s Device Process Development Center in Japan, has had its Molecular Imprints ‘Imprio’ 250 System upgraded to offer better mix and match overlay performance for 20nm full field resolution R&D device development. The system also has better wafer automation handling. Read more >>

The shift to multi-band, multi-mode radio functionality in today's handsets and the growth of Wi-Fi based-applications has enabled Soitec to develop and bring to market a high-resistivity (HR) silicon-on-insulator (SOI) substrate using 200mm wafers. Soitec's HR SOI substrate is claimed to offer >1kOhm.cm resistivity and is available in custom silicon and box thickness, according to the company. Read more >>

A major foundry has selected the ‘Integra’ dry strip system from Axcelis Technologies for its most advanced production facility. The customer was claimed to have selected the Integra over competitive products because of its significant advantages in productivity, advanced process capabilities and manufacturing flexibility. Delivery times were not disclosed.
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A Tier 1 memory manufacturer has placed a US$5 million order with Rudolph Technologies for its ‘S3000A’ and ‘MetaPULSE’ III thin film metrology systems. The systems purchase order represents a capacity buy and the tools are expected to be shipped to multiple fabs in 1Q and 2Q 2010. Read more >>