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Materials & Gases

News

MEMC becomes member of SOI Industry Consortium

16 March 2010
Having been developing SOI technology in house for many years and can offer partially depleted SOI, fully depleted SOI, strained SOI and other SiGe-on-insulator substrates has finally joined the SOI Industry Consortium. Read more >>

Gartner expects 29.5% growth in semiconductor silicon wafer demand in 2010

16 March 2010
A return to normal seasonal IC demand dynamics coupled to a rebuild in inventory levels from ICs though to silicon wafers will push wafer demand up nearly 30% in 2010, according to Gartner. Wafer demand in the fourth quarter of 2009 is estimated to increase 7% compared with the preceding quarter and is expected to grow a further 2 to 3% in the third and fourth quarters. Read more >>

CSMC using SOI wafers from Soitec for high voltage IC applications

16 March 2010
China-based analog specialty foundry, CSMC Technologies (CSMC) is using SOI wafers from Soitec for high voltage IC applications, initially aimed for colour plasma display panel (PDP) driver ICs and other mixed signal and analog applications. Read more >>

Product Briefings

New Product: New GORE ePTFE filters improve liquid filtration performance

26 November 2009
Product Briefing Outline: W. L. Gore & Associates has announced an addition to their line of high-performance cartridge filters for semiconductor applications. The new 40nm-rated filter, intended for use with chemicals in wet processes and distribution systems, provides 40nm retention while maintaining the flow of next-best-in-class 50nm filters. Incorporating a new high-flow ePTFE (expanded polytetrafluoroethylene) filtration media that allows a drop-in retention upgrade from 100nm to 30nm, enables cleaner recirculation baths, reduced processing times and significant savings in cost of ownership. Read more >>

New Product: Dow’s new copper polishing pad offers reduced chatter and micro-scratch defectivity

01 October 2009
Product Briefing Outline: Dow Electronic Materials has introduced the Optivision 4540 CMP Polishing Pad designed to deliver low defectivity and low cost of ownership (CoO) over the pad lifetime. The new pad is formulated with a unique, surfactant-free, polymer chemistry and pore structure to help minimize defectivity and provide higher dielectric film rates in copper barrier polishing. The pad has a dual pore structure that accurately controls polishing while providing a consistent polishing surface over the life of the pad. Read more >>

New Product: Norcimbus’ NBlend variable flow gas mixing system saves significant material loss

20 July 2009
The NBlend system from NorcimbusProduct Briefing Outline: The NBlend system from Norcimbus, offers a new option for mixed gases, bringing to market unique gas mixing technology that combines a MFC mixing system, surge tank, concentration analyzer and a proprietary Power Purge V controller. It is designed to mix two gasses to an adjustable ratio and supply a variable flow up to 250 standard liters per minute (slpm) continuously, while the concentration analyzer monitors and adjusts the blend ratio to maintain the concentration set point. It provides control accuracy of plus or minus 0.3 percent of the requested ratio, allowing it to deliver consistent results with varying flow rates and adjustable blend ratios. Read more >>

White Papers

Edition 38: The permeation resistance of polymers

27 January 2009
FT38By Chuck Extrand, Entegris, Chaska, Minnesota, USA - ABSTRACT - Polymers, commonly referred to as plastics, are widely used in the manufacturing of microelectronic devices. In addition to their many desirable properties, such as low cost, light weight, strength, ductility and ease of processing, polymers can be created free of metals and inorganic constituents that may interfere with sensitive clean room fabrication processes in multiple ways. For example, the loose molecular structure of polymers may allow the unwanted permeation of gases and simple liquids in fabrication facilities. This paper will provide a brief introduction to factors that influence permeation through polymers, discussing polymer structure background and its relation to permeation, and the influences of various polymer properties on permeation. Read more >>

Emerging materials in semiconductors

01 March 2008
Mark Thirsk & Mike Corbett, Linx Consulting LLC, Massachusetts, USA Read more >>

High-k/metal gate materials and processes for 32nm technology

01 December 2007
C. S. Park, G. Bersuker, S. C. Song, P. Kirsch & B. H. Lee, SEMATECH, Austin, Texas; R. Jammy, IBM assignee to SEMATECH
Read more >>