Online information source for semiconductor professionals

Linde North America has launched its new sub-atmospheric dopant gas source for the semiconductor and related industries. The Genii Sub-Atmospheric Gas Sources are used for ion implantation and use chemical complexing or electrochemical generation to deliver a high performance as required by IC manufacturers. Read more >>

Foundry company TowerJazz has entered into a development agreement with Soitec for the development of a turnkey solution for high-end backside illuminated (BSI) CMOS image sensors. With the BSI CMOS market looking set to replace the FSI technology with an expected $800 million take by 2013, the agreement will see the integration of Soitec’s substrates and new Smart Stacking technology with TowerJazz’s manufacturing process. Read more >>

After significant polysilicon and wafer price declines in 2009, MEMC executives have become more upbeat about demand and price stability entering the first quarter of 2010 and beyond. In a conference call to discuss fourth quarter results, the company noted that capacity utilization of silicon wafer production was at approximately 80%, with a demand recovery underway in the semiconductor industry, enabling a firming in prices to that sector. In solar, price declines were said to have moderated and the company was now shipping wafers to 10 of the top 25 PV manufacturers, compared to having made shipments to only 2 solar customers at the beginning of 2009. Read more >>

By Chuck Extrand, Entegris, Chaska, Minnesota, USA - ABSTRACT - Polymers, commonly referred to as plastics, are widely used in the manufacturing of microelectronic devices. In addition to their many desirable properties, such as low cost, light weight, strength, ductility and ease of processing, polymers can be created free of metals and inorganic constituents that may interfere with sensitive clean room fabrication processes in multiple ways. For example, the loose molecular structure of polymers may allow the unwanted permeation of gases and simple liquids in fabrication facilities. This paper will provide a brief introduction to factors that influence permeation through polymers, discussing polymer structure background and its relation to permeation, and the influences of various polymer properties on permeation. Read more >>

Mark Thirsk & Mike Corbett, Linx Consulting LLC, Massachusetts, USA Read more >>

C. S. Park, G. Bersuker, S. C. Song, P. Kirsch & B. H. Lee, SEMATECH, Austin, Texas; R. Jammy, IBM assignee to SEMATECH
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