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Microscopy resolution record claimed by Carl Zeiss
21 November 2008 | Comments (1)
Carl Zeiss SMT has said that it has set a new record resolution benchmark for scanning electron and ion microscopy, using its ‘ORION’ Helium- ion microscope. A surface resolution of 2.4 Angström (0.24 Nanometer) with (25%-75% edge-rise criterion) on various samples being achieved, the company said.
Read more >>Silicon wafer shipments fall 3 percent in 3Q08
13 November 2008
According to the SEMI Silicon Manufacturers Group (SMG) worldwide silicon wafer area shipments contracted almost three percent during the third quarter of 2008, compared to the second quarter. However, 2Q08 shipments were the highest recorded and came after a small decline in 1Q08, compared to 4Q07.
Read more >>ARM issues SOI IP library as IBM offers 45nm SOI foundry service
10 November 2008
After two-years in the making, ARM has released the first of its kind SOI library of physical IP for IC designers that will see IBM offer 45nm foundry services for a wide range of potential customers looking for low power benefits of the wafer technology.
Read more >>News From Around The Web
Silicon circuitry married to flexible substrates
25 November 2008 | Source: EE Times
Chartered seeks wafer testing suppliers in Taiwan
24 November 2008 | Source: Digitimes
iSuppli: Polysicon price to slide starting next year
21 November 2008 | Source: Eetasia.com
Product Briefings
New Product: SAFC Hitech ready with phase change memory precursors
09 September 2008
Product Briefing Outline: SAFC Hitech has made significant progress in developing Germanium Antimony Telluride (GexSbyTez or GST) precursors for use in high volume manufacturing phase change memory (PCM) applications. Extensive development work has been conducted with both the precursors and with the use of conventional Metal-Organic Chemical Vapor Deposition (MOCVD) techniques to deposit them, resulting in the successful deposition of device-quality GST.
Read more >>New Product: Air Products offers on-site xenon recovery
14 August 2008
Product Briefing Outline: Air Products and Chemicals
has introduced its new ‘XeCovery’ on-site xenon recovery service for
the semiconductor and MEMS industries. Xenon has a number of unique
properties that have attracted a variety of industries to use this
atom, including semiconductor manufacturing. With demand and prices on
the rise, there is a growing concern that cost will hamper its
applicability. Air Products uses its patented Vacuum Swing Adsorption
(VSA) technology as a means for recovering xenon from effluent gas
streams.
Read more >>New Product: Matheson’s ‘PICO-TRAP’ results in less than 20 ppb gas purity levels
28 July 2008
Product Briefing Outline: Matheson Tri-Gas Electronics
has introduced its patented ‘PICO-TRAP’ Ultra-Purification System for
removing volatile metal impurities and moisture from critical process
gases used by semiconductor manufacturers. The PICO-TRAP System
combines the principles of chemisorption and physisorption to achieve
higher levels of process gas purity than by conventional purification
technologies, according to the company.
Read more >>White Papers
Emerging materials in semiconductors
01 March 2008
Mark Thirsk & Mike Corbett, Linx Consulting LLC,
Massachusetts, USA
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High-k/metal gate materials and processes for 32nm technology
01 December 2007
C. S. Park, G. Bersuker, S. C. Song, P. Kirsch & B. H. Lee, SEMATECH, Austin, Texas; R. Jammy, IBM assignee to SEMATECH
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Memory material development at SEMATECH
01 September 2007
Paul Kirsch, S.C.Song, & Prashant Majhi, SEMATECH & Raj Jammy, IBM assignee to SEMATECH
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