Online information source for semiconductor professionals
TSMC??s U.S. IC design head goes to GLOBALFOUNDRIES
Popular articles
??Velocity?? the new buzzword in Intel??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
Subramani Kengeri has moved from TSMC to newly formed GLOBALFOUNDRIES as Vice President of Design Solutions. At GLOBALFOUNDRIES, he will report to Mojy Chian, who recently joined the company as senior vice president of design enablement. Kengeri was the head of TSMC’s U.S. based design centre.
“We are driving the transformation to a leading-edge foundry by leveraging talent from the industry’s top foundries and fabless semiconductor providers,” said Doug Grose, (pictuerd right) Chief Executive Officer of GLOBALFOUNDRIES. “Subramani brings a wealth of leading-edge foundry experience, and he clearly understands the technical and business challenges of design enablement on advanced technology nodes.”
“GLOBALFOUNDRIES entered the market with capacity, capabilities, and a differentiated value proposition,” Kengeri said. “I am excited about the opportunity to help rapidly build the customer-facing functions that are so critical for success in the foundry industry.”
Prior to joining TSMC, Kengeri held various engineering and management positions at Texas Instruments, Silicon Access Networks, Virage Logic, and others. Kengeri has been issued 24 U.S. patents, and he serves on the conference committees for CICC and ISLPED. He holds a master’s degree in electrical engineering from the Indian Institute of Technology and a certificate in executive management from AeA/Stanford University.