Online information source for semiconductor professionals
Spansion welcomes a new addition to its R&D team
Popular articles
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Spansion has appointed Dr. Saied Tehrani as senior vice president of research and development. Tehrani will be responsible for the company's technology and product development sectors, creating applications tailored to the specific needs of customers in the embedded portion of the Flash memory market.
"Saied is a strong addition to the Spansion executive team as we continue to expand our technology and product development capabilities," said John Kispert, president and CEO of Spansion. "I am confident that his considerable technical and product development expertise, combined with his strong leadership, will benefit our customers with innovative products that meet their application requirements."
Tehrani joins Spansion from Everspin Technologies where he was founder and COO. "I am very pleased to join Spansion at a time of tremendous opportunity for the company," said Tehrani. "The technology team has built a strong foundation for Spansion to deliver differentiated products that address evolving customer demands for world-class semiconductor products."