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GSA boosts focus on 3D IC test flows and test capacity management

13 June 2011 | By Mark Osborne | Going Places

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The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, announces the appointment of Dan Hamling, Sr. Director, IC Test and Assembly Business Development, GE Global Electronics Services, to serve as the GSA Test Interest Group Chairman. A key role Hamling will play is to establish objectives and initiatives for the Test Interest Group, which will also cover 3D IC test flows and test capacity management issues.

“I am honored to have the world-class support of GSA and the expert knowledge of test industry leaders as we seek solutions to the challenges facing semiconductor test, both today and tomorrow,” commented Mr. Hamling.  “I am looking forward to working alongside these experts to produce meaningful results for the industry as we explore tough topics such as 3D IC test flows and test capacity management.”

Prior to joining GES, Mr. Hamling was founder and CEO of Chip Nexus, a provider of test capacity management software solutions. Before that, Mr. Hamling spent 12 years in sales and marketing at Teradyne, following eight years in test engineering and test engineering management roles at various semiconductor companies. Hamling has a B.S.E.E. from the University of Michigan, an M.S.E.E. from Stanford University and an MBA from the University of Texas.

The first Test Interest Group meeting will be held on June 30 at 9:00am Pacific Time.

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