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IMEC, SRC join forces on environmentally friendly chipmaking initiative

18 February 2009
cebsm_labEuropean nanoelectronics research center IMEC and the Semiconductor Research Corp. have signed a memorandum of understanding to set up an international collaboration aimed at the creation of novel, environmentally friendly processes and materials for advanced semiconductor manufacturing. The research will be conducted between IMEC and the joint SRC/Sematech Center for Environmentally Benign Semiconductor Manufacturing, a well-established organization known for its expertise in addressing strategic ESH-related research challenges. Read more >>

SEMI’s Akira Inoue Award for EHS Excellence bestowed on Toshiba’s Atsutoshi Nishida

03 December 2008
A. NishidaIn recognition of his contributions to the fields of greenhouse gases reduction and commitment to efficiency in Toshiba’s daily operations, Atsutoshi Nishida, President and CEO of Toshiba Corporation, has been honored with the Akira Inoue Award for Environmental, Health and Safety Excellence. The award, which is presented by SEMI annually, aims to honor those in the industry who have displayed an outstanding achievement in raising awareness of environmental issues in their day-to-day work. Read more >>

TSMC hosts 2008 Green Forum on ‘green’ factories

31 October 2008
TSMC Fab 14Concern for the environment and sustainability is forefront on the priority list for TSMC, as it hosted its “2008 Green Forum – The Present and Future of Green Factories” recently. The company stressed the importance of information sharing in the industry to ensure ‘green’ awareness in all aspects of operations within the industry, with a particular emphasis on building fabs that encompass conscientious manufacturing and R&D practices. Read more >>

Product Briefings

New Product: PoU abatement system from TecHarmonic reaches 95 percent DRE

29 June 2006
TecHarmonicProduct Briefing Outline: TecHarmonic Inc. has launched the Alpine-S, claiming that it is the industry's first and only point-of-use (PoU) gas abatement system with the capability to abate all process and perfluorocompound (PFC) gas emissions with destruction and removal efficiencies (DRE) well over 95 percent for both chemical vapor deposition (CVD) and etch applications. Read more >>

White Papers

Measurement of conservation of energy by semiconductor manufacturing equipment and setting of target

01 March 2007 | Comments (1)
Philip Naughton, Freescale Semiconductor Inc. Assignee at SEMATECH, Austin, Texas, USA Read more >>

Intel’s EHS facilities equipment procurement process

01 December 2006
Mike Yurconic, Intel Technology Development EHS (TD EHS), Locationa Read more >>

manufacturing constraints – reducing volatile organic compound air emissions

01 June 2006
Scott Stewart, Intel Corporation, Hillsboro, OR 97124-6497, USA Read more >>