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austriamicrosystems plans to be 100% carbon neutral by 2015

30 May 2011
austriamicrosystems plans to be 100% carbon neutral by 2015Have spent the last 2-years mapping its carbon footprint, IC manufacturer austriamicrosystems is targeting to become 100% carbon neutral by 2015. The Austria-based firm said that it had already achieved a 50% reduction of CO2 equivalents or 31,000 tons by the end of 2010 and expects CO2 emission equivalents to decline by more than 9,000 tons in 2011, by switching to 100% green electricity based mainly on hydro-electric power sources. The compnay wants other semiconductor firms to follow its example. Read more >>

SEMICON West Sustainable Technologies Award finalists revealed

13 July 2010
Pall Corporation Water Reclaim SystemFive finalists have been listed for this year's SEMICON West, Sustainable Technologies Award, which includes Applied Materials, Edwards, Pall, Tokyo Electron and Verigy. The annual award recognizes equipment, materials or services that have been introduced to the marketplace in the last three years that can contribute to sustainable improvement of the environment. Read more >>

IMEC, SRC join forces on environmentally friendly chipmaking initiative

18 February 2009
cebsm_labEuropean nanoelectronics research center IMEC and the Semiconductor Research Corp. have signed a memorandum of understanding to set up an international collaboration aimed at the creation of novel, environmentally friendly processes and materials for advanced semiconductor manufacturing. The research will be conducted between IMEC and the joint SRC/Sematech Center for Environmentally Benign Semiconductor Manufacturing, a well-established organization known for its expertise in addressing strategic ESH-related research challenges. Read more >>

Product Briefings

New Product: PoU abatement system from TecHarmonic reaches 95 percent DRE

29 June 2006
TecHarmonicProduct Briefing Outline: TecHarmonic Inc. has launched the Alpine-S, claiming that it is the industry's first and only point-of-use (PoU) gas abatement system with the capability to abate all process and perfluorocompound (PFC) gas emissions with destruction and removal efficiencies (DRE) well over 95 percent for both chemical vapor deposition (CVD) and etch applications. Read more >>

White Papers

Measurement of conservation of energy by semiconductor manufacturing equipment and setting of target

01 March 2007 | Comments (1)
Philip Naughton, Freescale Semiconductor Inc. Assignee at SEMATECH, Austin, Texas, USA Read more >>

Intel’s EHS facilities equipment procurement process

01 December 2006
Mike Yurconic, Intel Technology Development EHS (TD EHS), Locationa Read more >>

manufacturing constraints ?? reducing volatile organic compound air emissions

01 June 2006
Scott Stewart, Intel Corporation, Hillsboro, OR 97124-6497, USA Read more >>