Online information source for semiconductor professionals

What wafer size will Intel‚??s D1X be?

26 October 2010 | By Mark Osborne | Editor's Blog

Popular articles

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

Hats off to C.J. Muse the semiconductor analyst at Barclays Capital for contemplating that Intel’s new fab, D1X could be primed to be its first 450mm fab.  Full details of the speculation can be viewed here at EETimes.  The fact that Intel said very little about its most significant new fab expansion plan in many years certainly adds fuel to the conspiracy theories.

Granted, Intel says as little as possible about such projects but something missing from the EETimes report and possibly from Barclays assessment (not seen the note to investors yet), is that you only need to look at the images Intel released of the projected facility to realize this is a massive fab and significantly larger than anything Intel has built before.

One trend that microprocessor companies have yet to follow is the ‘monster fab’ sized facility such as Toshiba/SanDisk fabs that have 250,000wspm capacity for NAND flash production.

Both Intel and AMD/GlobalFoundries went for capacity sizes of no more than 45,000wspm. One reason is market served and cost of equipment per node migration and that didn’t change during the monster fab era.

So something else is driving Intel to build such a huge fab and market share isn’t it.

UPDATE

In a webcast with Brian Krzanich, Senior Vice President, General Manager, Manufacturing and Supply Chain at Intel, covering the latest manufacturing investments, Krzanich did concede from a journalists question that D1X (though he called it D1E by mistake before correcting himself) would be 450mm capable but would start life as a development fab using 300mm wafers.

As usual, no further information was provided about the fab DI X specifications. 

 As the picture shows, D1X dwarfs everthing Intel has built in Oregon so far.

Is this big or what? Perfect for 450mm production!

Related articles

Tool order: Strasbaugh receives order for two silicon prime wafer polishing systems - 31 July 2009

Extending the Life of Existing Fabs Through Optimization - 01 March 1999

300mm Prime and the road to 450mm: Part 1 - 01 December 2007

Intel, Samsung and TSMC agree timing of 450mm pilot line - 06 May 2008

Bored with 450mm - 18 June 2008

Reader comments

PS: What was Fab 11X known for?
By Mark Osborne on 26 October 2010

Post your comment

Name:
Email:
Please enter the word you see in the image below: