Online information source for semiconductor professionals

Taiwan‚??s memory merry-go-round

23 July 2009 | By Mark Osborne | Editor's Blog

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

The consolidation in DRAM memory manufacturers is still looking a distant dream after many months and two quarters of this year already gone without any real developments. Taiwan government’s new quango, Taiwan Memory Co is being supported with a paltry NT$30 billion, just enough for office expenses while few memory players are wanting to actually play with TMC in the playground!

New news of the silly situation highlights that the Taiwan government is hoping to invest in a couple of struggling firms as soon as they have received proposals from them.

You would have thought this would all have been done months ago. Indeed it probably was and that didn’t suit anyone so it would seem were entering another phase of negotiations as the story seems to suggest.

Basically, nothing has really happened and this new round would suggest that nothing probably will, but we can all keep our fingers crossed.

Although the financial issues are the biggest problem, the real challenge should any or all survive the financial crisis is migrating to more competitive technology nodes. Samsung, Hynix and Micron are all now racing ahead with 50nm production and below, while Taiwan sits hopelessly at the 70nm node.

It will take 3 to 5X the NT$30 billion TMC is being entrusted with to get that job done. Unfortunately a job they don’t seem set up to do. You would have thought that the merry-go-round would have stopped by now!

Related articles

Hynix to receive US$960 million in new funding - 22 April 2009

NexPlanar completes $14.5 million financing round to fund new CMP pad technology - 11 July 2008

Creditors back Hynix to the tune of US$597 million - 23 December 2008

Molecular Imprints secures $12.9 million financing round - 19 May 2008

Surrey NanoSystems raises US$4.2m for nanotube IC interconnects - 25 August 2009

Reader comments

A "poultry" NT$30 billion? Quack, quack, Mark! Hopefully it will be enough for MOEA execs to buy a few chickens to raise at home after they lose their jobs.
By Anon on 24 July 2009
you mean paltry NT$30 Billion, right? I'm assuming this amount has nothing to do with fowls..
By George on 23 July 2009

Post your comment

Please enter the word you see in the image below: