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Product Briefing Outline: Crossing Automation has announced that it has improved its Spartan equipment front end module (EFEM) performance, enabling it to achieve 450 wafers per hour (wph) throughput. By upgrading Spartan’s production-proven software algorithms for wafer move paths, Crossing Automation now has the highest throughput capability of any commercially available EFEM, while maintaining Spartan’s established reliability and cleanliness performance. Read more >>

Product Briefing Outline: ExpressSolutions starts by identifying and understanding a customer’s requirements for a specific process and ends with the implementation of an optimized wafer transfer system. By using Crossing’s modular ‘ExpressConnect’ automation solutions, ExpressSolutions delivers custom configurations that reduce overall cost and time-to-market while maintaining OEM differentiation at the process level. As part of the offering, ExpressSolutions facilitates the design, system integration and documentation of a complete wafer automation platform and its ongoing support. This allows customers to leverage internal engineering resources and achieve reduced acquisition costs, reduced inventory build-up and benefit from low platform support costs. Read more >>

Product Briefing Outline: Crossing Automation’s ‘ExpressConnect’ family of wafer-level automation components is designed to provide the industry with a standardized platform that delivers both high-reliability and high-throughput to vacuum wafer handling systems for semiconductor manufacturing. It uses a unique modular solution to wafer-level automation for semiconductor manufacturing that delivers a 20 to 70% smaller footprint; greater flexibility; lower cost; higher productivity; and throughput up to 250 wafers per hour. Read more >>