Online information source for semiconductor professionals

Product Briefing Outline: ExpressSolutions starts by identifying and understanding a customer’s requirements for a specific process and ends with the implementation of an optimized wafer transfer system. By using Crossing’s modular ‘ExpressConnect’ automation solutions, ExpressSolutions delivers custom configurations that reduce overall cost and time-to-market while maintaining OEM differentiation at the process level. As part of the offering, ExpressSolutions facilitates the design, system integration and documentation of a complete wafer automation platform and its ongoing support. This allows customers to leverage internal engineering resources and achieve reduced acquisition costs, reduced inventory build-up and benefit from low platform support costs. Read more >>

Product Briefing Outline: Crossing Automation’s ‘ExpressConnect’ family of wafer-level automation components is designed to provide the industry with a standardized platform that delivers both high-reliability and high-throughput to vacuum wafer handling systems for semiconductor manufacturing. It uses a unique modular solution to wafer-level automation for semiconductor manufacturing that delivers a 20 to 70% smaller footprint; greater flexibility; lower cost; higher productivity; and throughput up to 250 wafers per hour. Read more >>

Product Briefing Outline: Brooks Automation has introduced the vacuum process tool automation platform ‘Marathon 2 Nano,’ which is designed to enable smaller footprints for 300mm semiconductor processing equipment. Brooks has included many new features developed from interrelated components that are designed to offer improved process module architecture. Brooks Automation’s Marathon 2 Nano vacuum transfer platform with MagnaTran 9 vacuum robotics and Fusion controls enables a combination of layout flexibility, process module density and overall productivity improvement. Read more >>