18 September 2008
Product Briefing Outline: Oerlikon Leybold Vacuum has introduced TURBOVAC SL, a line of high-reliability mechanical turbomolecular vacuum pumps for semiconductor manufacturing, analytical instrumentation, R&D and other demanding applications. The pumps feature extreme durability, ease of use and several innovations that simplify and improve incorporation into customer equipment.
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08 July 2008
Product Briefing Outline: NEHP has utilized return on
investment modeling developed in-house to better assess the cost of
installation of major tools using a modular approach versus traditional
stick-built methods and the timeline for tool installation from Dock to
Signoff. According to NEHP, its 3D or 2D P&ID pre-packaged modules
have reduced costs by an estimated 14 – 49% (based on degree of
modularity and tool complexity) and schedules by as much as 30 to 35%
from start to finish (see Figure 1). Complete tool pre-facilitization
techniques and solutions prior to tool arrival on the fab floor have
been developed, resulting in significant cost savings that have been
modeled by NEHP.
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30 May 2008
Product Briefing Outline: INFICON has introduced the
XTC/3 a thin film deposition controller for single and multiple-layer
processes. The XTC/3 utilizes INFICON's patented ModeLock technology
that provides mode hop prevention while in operation. The controller is
designed to provide accurate control of deposition rate and thickness,
for virtually any number of layers, while it is easy to install and
offers high reliability, according to the company.
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