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New Product: Polyurethane formulation provides softer CMP pad surface |
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Nov 25, 2005 at 05:25 PM |
Product Briefing Outline: Rohm and Haas
Electronic Materials has introduced a new type of CMP pad under the "VisionPad"
banner. The "VP3100" is claimed to be the industry's first polishing pad to
combine the benefits of hard and soft pads for advanced CMP applications. The
VisionPad VP3100 is designed to provide both excellent planarization capability
and low defectivity during volume production of copper (Cu) wafers, enhancing
throughput and reducing overall cost of ownership at the 65nm technology node,
according to the company.
Problem: As chip
manufacturers move toward 65nm node device production, they're experiencing
yield losses from defects that were once tolerable, especially in the copper
barrier step. Unlike soft pads typically used in this application, the
VisionPad VP3100 CMP pad can also be conditioned. This allows for pad surface
regeneration to achieve optimal polishing results that are constant throughout
the pad's life as well as from pad to pad.
Solution: The VisionPad
VP3100 polishing pad is the first offering in the company's new VisionPad CMP
polishing pad series. The polishing pad's proprietary polyurethane formulation
provides a softer surface than a traditional hard pad to reduce defects while
maintaining the rigidity needed to deliver good planarization during CMP in
copper barrier processes. By using a new group of polymer chemistries, the
advanced pad technology improves die yields through minimization of scratches
and chatter marks across the wafer. The pad life is also equivalent to the
industry standard hard pad and surpasses that of the industry standard soft
pad. This unique blend serves to balance all platens, reducing down time and
break-in wafers while improving process throughput, according to the company.
Applications: Although targeted
for 65nm applications, the VP3100 CMP pad has the ability to backfill into
current 130nm and 90nm processes.
Platform: Proprietary
polyurethane formulation.
Availability: The VP3100 pad is
currently in production at Asian foundries and a European device manufacturer
and will be commercially available in January 2006.
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