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Siltronic Samsung 300mm wafer fab plans ramp-up in 1H08
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Siltronic Samsung Wafer Pte. Ltd, the joint venture 300mm wafer
production fab in Singapore, is expected to aggressively ramp
production starting in the first half of 2008. The production of
qualification wafers is already ongoing, according to Wacker AG,
Siltronic’s parent company in disclosing full-year financial results.
Construction started in August 2006.
“Our 300 mm joint venture with Samsung in Singapore has already begun
to produce qualification wafers,” commented Wacker CEO, Peter-Alexander
Wacker “The building, infrastructure and equipment were completed in
record time. We expect the steep ramp-up to start in the first half of
2008. By the end of 2010, the joint venture should have a monthly
capacity of 300,000 wafers.”
At its Burghausen plant, Siltronic
doubled its monthly capacity for 300mm wafers to 135,000 in 2007, while
it targets 200,000wspm at its facility in Freiberg. The Singapore
facility is expected to be the main facility for wafer capacity
expansion in the next few years.
