|
19th Edition: RF-based sensor technology improves cleaning efficiency on PECVD tools |
|
|
|
Jul 21, 2003 at 11:03 AM |
|
Michael Bonner & Randall Clark, IBM Microelectronics
ABSTRACT Implementing an active RF sesorbased endpoint of PECVD chamber cleaning on several process tools in a wafer fab production line has demonstrated how this approach can reduce gas consumption and processing times, as well as increase tool throughput and improve onwafer particle performance.
19th Edition: RF-based sensor technology improves cleaning efficiency on PECVD tools
|