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Home arrow Critical Components arrow Edition 19 - Published July 2003 arrow 19th Edition: RF-based sensor technology improves clea...
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19th Edition: RF-based sensor technology improves cleaning efficiency on PECVD tools Print E-mail
Jul 21, 2003 at 11:03 AM

Michael Bonner & Randall Clark, IBM Microelectronics

ABSTRACT

Implementing an active RF sesorbased endpoint of PECVD chamber cleaning on several process tools in a wafer fab production line has demonstrated how this approach can reduce gas consumption and processing times, as well as increase tool throughput and improve onwafer particle performance. 

19th Edition: RF-based sensor technology improves cleaning efficiency on PECVD tools
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