Mohamed Saleem & Sowmya Krishnan, Ultra Clean Technology

ABSTRACT

Several semiconductor processing steps, such as rapid thermal processing (RTP), oxidation, photoresist strip/ashing, post-metal etch passivation, utilize steam to accelerate growth rates or removal rates. In RTP and oxidation processes, the use of steam as a process gas provides the ability to grow thin, highquality dense oxides that have fewer defects and exhibit low interfacial stresses. In photoresist strip processes, controlled addition of a small amount of steam has been shown to improve the ashing rates and facilitate the removal of sidewall residues.