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Vacuum cluster platform with improved compact configuration |
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Sep 27, 2005 at 11:12 PM |
 Product Briefing Outline: Brooks Automation, has
announced the release of the ‘Marathon 2' vacuum platform for process
and metrology equipment. The Marathon 2 vacuum platform, available in
compact and cluster configurations, provides increased performance and
shorter integration and cycle times for vacuum applications at 90nm
technology nodes to sub-45nm nodes.
Problem: Equipment companies are driving for shorter sub-system
delivery times in an effort to provide faster response to order
lead-times and shipment deadlines.
Greater levels of integrated sub-systems are a key method to meet these
demands. Tool platforms also need to be smaller and more compact to
meet fab layout
and sub-floor layout demands.
Solution: Marathon 2 is a vacuum platform for process and
metrology equipment. It features a high performance, configurable
design with ‘CenterSmart' technology to enable precise, repeatable
wafer placement in vacuum with real time automatic trajectory
correction to offset process induced wafer shifts that could lead to
wafer damage during subsequent handling. Available in compact and
cluster configurations,
Marathon 2, provides increased performance and shorter integration and
cycle times for vacuum applications at 90nm technology nodes to
sub-45nm nodes, according
to the company.
Applications: The Marathon 2 platform can be used for nearly all
vacuum applications, including CVD and etch, while the ‘Marathon 2
Compact' supports these as well as metrology in what company claims to
be the industry's smallest footprint 300mm vacuum system.
Platform: Incorporating innovations in vacuum system design and
leveraging the highly successful ‘MagnaTran' vacuum robot technology,
the Marathon 2 platform
features high throughput, small footprint and excellent reliability,
according to the company. The Marathon 2 platform employs ‘CenterSmart'
technology from Brooks
that enables precise, repeatable wafer placement in vacuum with real
time automatic trajectory correction to offset process induced wafer
shifts that could lead to wafer damage during subsequent handling.
Availability: July 2005 onwards.
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Product Briefings 
