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Point-of-use filter for subpart per billion levels |
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Sep 27, 2005 at 10:57 PM |
 Product Briefing Outline: Pall Corporation has
introduced a new medium to purify the fluorocarbon process gases used
in the world's most advanced semiconductor manufacturing facilities.
The latest product from its ‘AresKleen' family of point-of-use
purification media, the new FCP medium removes molecular contaminants
to sub-part per billion levels, helping to improve manufacturing yields
in IC devices with features as small as 65nm.
Problem: Fluorocarbon gases are used frequently in an array of
critical semiconductor manufacturing applications, including plasma
etching, chamber cleaning and dielectric deposition. As manufacturers
scale device feature sizes to 65nm, these applications become less
tolerant of molecular impurities, which can inhibit yields by inducing
process variables, such as changes in etch rates and film thickness.
Solution: Pall developed the FCP medium to purify traditional
fluorocarbon gases, including trifluoromethane and carbon
tetrafluoride, as well as newer, environmentally friendly gases, such
as heptafluoropropane (halocarbon 227) and tetrafluoroethane
(halocarbon 134a). Designed for use with Pall's ‘Gaskleen' point-of-use
purifiers, the
AresKleen inorganic medium has high capacity for removing oxygen,
moisture, carbon dioxide and other impurities via irreversible chemical
reaction. The purifier assemblies are suitable for use as a drop-in
replacement for traditional particle filters. The assemblies also
contain an integral 3nm filter for removal of particulate contamination.
Applications: Includes trifluoromethane, carbon tetrafluoride heptafluoropropane (halocarbon 227) and tetrafluoroethane (halocarbon 134a).
Platform: Designed for use with Pall's Gaskleen pointof-use purifiers.
Availability: June 2005 onwards.
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Product Briefings 
